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日立钨灯丝扫描电子显微镜SU3800,SU3900

Origin category:  Import Image resolution of backscattered electrons:  4.0nm@30KV(Low vacuum mode)
Secondary electron image resolution:  3.0nm Accelerating voltage:  0.3-30KV
Gain:  x5-300,000,x7-800,000    
Type of instrument:  Tungsten filament    

In the industrial field dominated by nanotechnology and biotechnology, SEM has been flexibly applied in a variety of observations and analyses, from the fine structure of the substance to the composition. The use of SEM is expanding day by day, but for industrial materials such as steel and oversized/overweight samples such as auto parts, the size and weight of the sample that the electron microscope sample table can correspond to is limited, so cutting and other processing are required for observation. Therefore, it is an important issue to directly observe the surface fine morphology and perform various analyses without processing the super-large samples.

In recent years, in order to achieve higher functionality and performance of various materials, it is necessary to observe and optimize the fine structure of the materials. At present, the application of SEM has been extended to quality and production management in addition to previous research and development, and the frequency of use is increasing. At the same time, the market has put forward higher requirements on the operating performance of the instrument to further reduce the burden on the operators.

The "SU3800" and "SU3900" released this time support the observation of oversized/overweight samples, especially the large scanning electron microscope "SU3900", which can be equipped with a maximum diameter of 300mm *1, and a maximum load-bearing sample of 5kg (increased by 2.5 compared to the previous model) Double *2) sample stage, even super large samples can be observed without cutting processing.

At the same time, the operating performance has also been fully upgraded. After the sample is installed, the image is adjusted through automatic light path adjustment and various automatic functions, and then the sample image can be obtained immediately, which truly realizes fast observation.

The previous model only used the single color image of the CCD navigation camera to find the field of view*3. The new model uses the rotating sample stage to shoot each part of the sample separately, and then stitch each image into a large image, which realizes the camera navigation observation with a large field of view, which is very suitable for large-scale observation of super-large samples.

【Main feature】

(1) Support for testing of oversized/overweight samples

Maximum sample size that can be carried: "SU3800" comes standard with a sample compartment that can carry samples with a diameter of 200mm, which can handle samples with a maximum height of 80mm and a weight of 2kg. "SU3900" is a large-scale scanning electron microscope of Hitachi High-Tech. It is equipped with a sample chamber with a maximum diameter of 300mm as standard. It can handle samples with a maximum height of 130mm and a weight of 5kg (2.5 times higher than the previous model*2).

(2) Support wide field of view observation

■ The maximum observation ranges of "SU3800" and "SU3900" are respectively: diameter 130mm and diameter 200mm

■The navigation function "SEM MAP" is installed, and the field of view can be moved by simply specifying the observation target location on the navigation screen

■A "Multi Zigzag" system is installed, which can automatically shoot multiple high-magnification images in different fields of view, and stitch the obtained images together to generate a large field of view high-pixel image

(3) Improve operation performance through automation

■Through automatic light path adjustment and various automatic functions, the observation can be started immediately after the sample is set. Regarding image adjustment, the waiting time for automatic function execution is reduced by less than one-third compared to the previous model*4

■The "Intelligent Filament Technology (IFT)" software is installed to automatically monitor the status of the tungsten filament*5 and display the expected replacement time. In the long-term continuous observation and large-field analysis such as particle size analysis, it can also avoid the interruption of observation caused by the expiration of the service life of the tungsten filament during the long-term test.

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